GE has announced a breakthrough in Thermal Material system that could pave way for faster computing and better heat transfer. GE has been working for DARPA on a new phase-change based thermal conductor that has the ability to cool electronic devices 200% better than copper for 25% the current weight.
The new material demonstrated has been tested to work under 10 times normal gravity that makes it applicable for almost all purposes, including space technology and avionics. The unique surface engineering coating, with the integration with nano technology is lighter and also likely to increase computing speeds.
This multi-year effort from GE is meant to build a complete thermal solution platform to serve multiple GE businesses like GE Aviation, GE Energy and GE Intelligent Platforms.
Author: Vinod
Source: Engadget
The new material demonstrated has been tested to work under 10 times normal gravity that makes it applicable for almost all purposes, including space technology and avionics. The unique surface engineering coating, with the integration with nano technology is lighter and also likely to increase computing speeds.
This multi-year effort from GE is meant to build a complete thermal solution platform to serve multiple GE businesses like GE Aviation, GE Energy and GE Intelligent Platforms.
Author: Vinod
Source: Engadget
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